february 2010 doc id 16056 rev 2 1/8 8 BAL-2690D3U 50 / 30+j25 balun transfor mer for 2.45 ghz ism band features 50 nominal input / 30+j25 output differential impedance low insertion loss low amplitude imbalance low phase imbalance small footprint: BAL-2690D3U < 1 mm2 benefits very low profile (<700 m) high rf performances rf bom and area reduction applications balun transformer for applications such as: bluetooth stlc2690 mobile phone description the BAL-2690D3U is a balun designed to transform single ended signals to differential signals in bluetooth applications. the BAL-2690D3U has been customized for the stlc2690 bluetooth transceiver with 0.8 db insertion losses in the bandwidth (2400 mhz - 2500 mhz) and with a specific requirement for the s cc22 parameter. the BAL-2690D3U has been designed using stmicroelectronics ipd (integrated passive device) technology on non conductive glass substrate to optimize rf performances. figure 1. top view figure 2. application schematic tm : ipad is a trademark of stmicroelectronics. flip-chip 4 bumps se gnd bal + bal - z c top view a1 b1 b2 a2 - z c a1 b1 b2 a2 se b2 b1 a2 bal+ gnd bal- rf input rf balanced ouput ground rf balanced ouput a1 name description bump band pass filter bt rfic bt balun 2.4g antenna wlan pa + sp3t www.st.com
electrical characteristics BAL-2690D3U 2/8 doc id 16056 rev 2 1 electrical characteristics table 1. absolute maximum ratings (limiting values) symbol test condition min. typ. max. unit p in input power r fin - - 20 dbm v esd esd ratings mil std883g (hbm: c = 100 pf, r = 1.5k , air discharge) esd ratings, machine model (mm: c = 200 pf, r = 25 l = 500 nh) esd ratings, charged device model (cdm) (jesd22-c101d) 2000 500 500 --v t op operating temperature -40 - +85 c table 2. electrical characteristics (t amb = 25 c) impedances symbol test condition min. typ. max. unit z out nominal differential output impedance - 30 + j25 - z in nominal input impedance - 50 - table 3. rf performance symbol test condition min. typ. max. unit f frequency range (bandwidth) 2402 2441 2480 mhz i l insertion loss in bandwidth - 0.8 1.1 db ripple ripple in bandwidth - - 0.6 db r l return loss in bandwidth 14 - - db imb phase imbalance -10 - 10 a imb amplitude imbalance -1 - 1 db r cmrr common mode rejection ratio (s sc12 )20--db s cc22 magnitude for common mode harmonic rejection coefficient @ 2f o from 4804 mhz to 4960 mhz, 25 is considered as reference for cm 0.7 - 1 phase for common mode harmonic rejection coefficient @ 2f o -45 - 0
BAL-2690D3U electrical characteristics doc id 16056 rev 2 3/8 figure 3. insertion loss (t amb = 25 c) figure 4. return loss (t amb = 25 c) 2.2e9 - 1.4 2.7e9 2.6e9 2.5e9 2.4e9 2.3e9 - 1.3 - 1.2 - 1.1 - 0.9 m2 m1 db f(hz) - 1.0 ripple in band 0.02 db typ. 2.2e9 2.7e9 2.6e9 2.5e9 2.4e9 2.3e9 -10 -15 -20 -25 -30 f(hz) db figure 5. amplitude imbalance (t amb = 25 c) figure 6. phase imbalance (t amb = 25 c) 2.2e9 2.7e9 2.6e9 2.5e9 2.4e9 2.3e9 -1.0 1.0 0.5 0.0 -0.5 f(hz) db 2.2e9 2.7e9 2.6e9 2.5e9 2.4e9 2.3e9 -10 5 0.0 -5 10 f(hz) figure 7. s cc22 magnitude @ 2f0 (t amb = 25 c) figure 8. s cc22 phase @2f0 (t amb = 25 c) 0.7 4.6e9 1.0 0.9 0.8 5.2e9 5.0e9 4.9e9 4.8e9 4.7e9 5.1e9 f(hz) 4.6e9 0 - 30 - 40 5.2e9 5.0e9 4.9e9 4.8e9 4.7e9 5.1e9 f(hz) - 50 - 10 - 20
electrical characteristics BAL-2690D3U 4/8 doc id 16056 rev 2 figure 9. recommend land pattern (used for balun characterization) figure 10. example of transceiver application board land pattern no gnd under the die in l1 gnd under the die in l2 35 m 76 m 18 m 540 m 18 m 35um 76 m l1 l2 l3 l4 l1 l2 l3 l4
BAL-2690D3U package information doc id 16056 rev 2 5/8 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions (definitions) table 4. package dimensions (values) ref. dimensions millimetres inches min. typ. max. min. typ. max. a 0.565 0.63 0.695 0.022 0.025 0.027 a1 0.17 0.205 0.24 0.007 0.008 0.009 a2 - 0.4 - - 0.016 - b 0.215 0.255 0.295 0.008 0.010 0.012 d 0.86 0.91 0.96 0.034 0.036 0.038 d1 - 0.474 - - 0.019 - e 0.86 0.91 0.96 0.034 0.036 0.038 e1 - 0.474 - - 0.019 - se - 0.237 - - 0.009 - $ - 0.025 - - 0.001 - a1 b1 b2 a2 d d e e1 a d1 b se a 2 $ a1 z c
package information BAL-2690D3U 6/8 doc id 16056 rev 2 figure 14. flip-chip - tape and reel specification note: more packing information is av ailable in the applications note: an 2348: ?flip-chip: package description and recommendations for use? figure 12. footprint figure 13. marking copper pad diameter: 220 m recommended solder mask opening 300 m minimum solder stencil opening: 220 m recommended x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 2.0 0.05 1.75 0.1 3.5 0.05 ? 1.50 0.10 0.73 0.05 0.20 0.015 1.0 0.05 8.0 0.3 1.0 0.05 dot identifying pin a1 location x y x w z w x y x w z w x y x w z w
BAL-2690D3U ordering information doc id 16056 rev 2 7/8 3 ordering information 4 revision history table 5. ordering information order code marking package weight base qty delivery mode BAL-2690D3U rp flip-chip 1.02 mg 5000 tape and reel table 6. document revision history date revision changes 25-jan-2010 1 first issue. 08-feb-2010 2 updated ta bl e 1 and figure 10.
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